Technology
IBM and Siemens Team on Nanostack Chip Research
IBM and Siemens announced research collaboration to advance IBM's 3D nanostack transistor architecture toward manufacturing beyond the current 7 angstrom node.
semiconductors
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IBM, with Siemens, announced research aimed at advancing IBM's nanostack transistor architecture toward production. The collaboration combines IBM's semiconductor device work with Siemens' electronic design automation, process simulation and lithography expertise, focusing on design, simulation and lithography techniques for current and future nanostack generations.
IBM and Siemens Team on Nanostack Chip Research ↗
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